工作描述:
Laser welding development and production import for 100G BOSA product, 100G BIDI, 28G TOSA and laser stealth dicing for front process(chip separation )。

工作描述:
1. Wire Bonding process study: including the bonding parameters optimization and new process development, such as pre-deforming process development and laser induced ball process development。
2. laser process deveopment: 1)focus on 5W and 14W solid state laser 532nm wavelength process development,25W and 50W fiber laser 1064nm wavelength process development,12W picosecond laser(1064nm wavelength)process development.including Solar Cell (Wafer) Cutting、Scribing、Dicing and drilling, glass cutting, Sapphire Cutting, Ceramic Cutting, Copper Lead frame Cutting, Steel Cutting,silicon wafer cleanning etc.
2)finished solar blade machine and AOI machine process development and machine release，and finished laser test platform development.