Provide pixel architectures and performances in line with product division roadmap. Imagine, design and validate pixels, SPADs and their related testchips. Responsibilities: Manage Innovation & People, roadmap definition and execution, PDK Teams coordination, customers support. Highlights: Innovative pixel architectures, SPAD and associated quench circuits. New test circuits development.

FDSOI & Advanced Technologies : develop state of the art modeling solutions to support Process and Design Platform milestones. Responsibilities: people management, planning execution, MHC database, customer interface. Highlights: 28FD: Technical referent and coordinator for the SPICE, DRM and DK teams (OBEYA). IMAGING: coordination of the SPICE offer updates and improvements for process maturities. SPICE Leader of the 28FD technology transfer to SAMSUNG, with a joint SEC-ST models’ extraction. Third Parties CAD integration: 40nm TSMC, 32-28nm ISDA.

Crolles2 Alliance : Characterization and modeling of MOS components for the 90, 65 and 45nm technologies. Responsibilities: Interaction with the design’s teams of the Alliance’s companies for new model functionalities integration (matching, corner, WPE, STI stress). Highlights: Technical Leader of the PSP 45nm project (2006): new PSP compact model validation, development of the extraction & toolkit strategy, training of new engineers, measurements planning, management of the different model extractions and deliveries amonga5people team.

Post PhD at LETI (SOI Team), LEG (Power Electronics Team) : study of interactions between dielectric insulated cells". Realization of power electronic components characterization benches, modeling and simulation of electronic devices.

Power Electronics Laboratory, Lasers Development , 20kA), realization of a high voltage probe calibrator and an electrolytic capacitor ageing bench. COMPETENCIES Drive innovation, teamwork, pugnacity, adaptation to changes, autonomy. General Coordination, communication, reporting, motivation, coaching. Management Technical Pixel & SPAD, image sensors, technology benchmarking, IP derisking, impact analysis, electrical characterization, customer interface. English: fluent.