Silver Sintering Technology
This project was to evaluate an innovative low-temperature sintering technology that
may enable a new level of benefits to power semiconductor packaging for e-mobility applications, especially to SiC dice. Working with several business partners to achieve the
followings that including build up a working team (financial investor, local production
and sales channel) and definition of recommended process solutions. The goal is to
transfer this innovative technology from Europe to Asia and to sell products under own
brand name in the market.
-- Evaluate and test this technology in Taiwan - finding feasible process parameters for
silver sintering application without the need of pressure for die-attach. Identify
manufacturing tools together with local business partners and package it as the process
solution.
-- Competition analysis including market intelligence, benchmark among different
competitors' products and evaluation on different sales strategic options
-- Invite strategic investor for technology transfer transaction, licensed production and
sales in great China market

Advanced Packaging Business Line
Responsibilities:
- Capital equipment sales in advanced semiconductor packaging market in Taiwan that
including 3 new application demands
1) Fine-pitch interconnect of flip-chip ICs - TCB bonder
2) Fan-out ICs - High-speed hybrid chip shooter
3) Mass-transfer technology - Mini LED bonder
-- Lead and work with cross-functional team to engage opportunities to tire 1 account
group. Focus on penetration and deployment of evaluation tool for passing customer
qualifications.
-- Work with product team to develop local strategy and resource to support various
application requirements in advanced packaging market, e.g., C2S, C2W, Fan-out,
SiP assembly and mass-transfer applications
-- Coordinate and build large account management to ASE, SPIL, tsmc and Unimicron.
Planning sales strategy, coaching direction and establish relationships with senior executives
-- Aftermarket products sales – consumables and spares, wafer saw blades
-- Key achievement ref.
(1) Deliver 140% AOP result in FY2019
(2) Success story of TCB qualification and win orders from tier 1 account
(3) Win order of high-speed chip shooter for SSD module assembly
(4) Win order of high-speed chip shooter for CoWoS and IC substrate manufacturing
(5) Win order of mass-transfer bonder for Mini LED assembly

Organometallics
I am the start-up employee in this new business unit in Chemtura Taiwan, to develop the high purity metal organic precursors business (MO source) in LED epitaxy market.
Lead 1 FAE and report directly to managing director of joint venture, DayStar Materials
Responsibilities:
-- Approach to Tire 1 Taiwanese LED fabs and build up high level relationships
-- Drive qualification opportunities, negotiation of pricing and commercial matters
-- Work with global CS team on customer order fulfillment and Korea team on logistic
flow for dangerous goods transportation
-- Start-up of resource set-up for local warehouse
-- Key achievement ref.
(1) Success to penetrate as a qualified TMG/TMA supplier and win orders from Epistar
group

Sales Manager - Assembly Materials Business Line
Deputy Sales Manager – Contact Materials Division
Business development and management - manage a diversified product portfolio in the
business unit including bonding-wire, solder paste, soft solder, micro-ball, tacky flux,
die-attach adhesive, SMT glue and low-alpha materials.
Responsibilities:
-- Lead a team of 2 FAE+1CS and 2 major distribution partners
-- Capture commercial opportunities along the flip-chip IC technology with focus on
flip-chip IC assembly, wafer and substrate bumping - solder, flux and micro-ball related
-- Launch of Cu bonding-wire penetration for replacement of Au-wire market
-- To increase soft solder revenue for automotive applications
-- Develop die-attach adhesive opportunities in Taiwan market from 0 to 1
-- Develop local distributors and manage the sales KPI
-- Coordinate 3rd party RD project in Taiwan regarding die-attach adhesive formulation
for passing JEDEC reliability test
-- Key success penetrations
(1) Outstanding penetration result of Cu bonding-wire in Taiwan market
(2) Success developed die-attach adhesive business in MicroSD market
(3) Success penetration of low-alpha solder business for wafer bumping application
(4) Success penetration of SMT solder paste business for flip-chip IC assembly in top 1 account
(5) Market majority of soft solder for automotive

D-TEK is a famous SMT equipment distributor in the market and she brings me into
semiconductor world in 2005. Major product portfolio of D-TEK is famous brand in SMT
industry and related to solder reflow manufacturing process
Responsibilities:
-- Capital equipment sales for flip-chip IC assembly and wafer/substrate bumping – the
total SMT line solution including DEK solder printer, Samsung pick&place, Heller reflow
oven and AOI equipment
-- Focus on SPIL account and PPT account for capture commercial opportunities and new
qualification
-- Success pass qualification of 1st wafer ball placement tool in SPIL and win order

Deputy Manager - Marketing & Sales
Sales Engineer - Marketing & Sales
My first job in the industry. Serve as a sales role and responsible for optical instrument
product sales, the laser interferometer, laser collimator and spectra meter for optical
storage (CD/DVD) and LED packaging markets
Responsibilities:
- Work closely with all Taiwanese DVD player and spindle motor makers for the sales of
laser collimator. Promotion of optical pick-up head tester for the correction of coma
aberration and this is a very dedicated optical equipment from Japan maker
- Work with RD manager to promote and sell laser interferometer to research lab. for
various of high accuracy vibration measurement in a nanometer scale
- Engage to LED packaging house for the sales of optical testing tool such as Spectra meter
- Response for optical component sales to university and research institute

Military officer - 2nd lieutenant
Responsibilities:
- Leadership for the maintenance work of HAWK missile system
- Military management and daily activity assignment
- Ensuring the safety and work discipline of troops according to relevant regulations