At Comet led a team of R&D and product development and manufacturing engineers to create 400+ new and improved RF Matching networks solving critical process problems for Lam Research, Applied Materials, Mattson Technologies, AMEC, Naura, and more.

In my 22 years with the company, I led multiple product design teams with over 18 patents in Hardware and process technology for Etch, CVD, PVD, CMP, Electroplating, metrology thickness, and endpoint control.
Leader of Product Continuous Improvement (CIP) programs for
· Process Improvements for
· Throughput, Uniformity, Improved film properties, Defect reduction
· Hardware & component improvements in:
· Machining, Cleaning, Electroplating, Anodization, and Contamination reduction on process chamber elements heaters, pumping plates, showerheads, ceramics, and shields.
· Product reliability Improvements
· OEM Products RPS, RF Generators, RF Matches, DC Power supplies, Vacuum and Atmospheric Robots
· Process Kits – Quality, repeatability for heaters, showerheads, electrostatic chucks
· Developed Best Known Methods (BKMs) for hardware anodization, plating, cleaning, procedures for process control
· Wafer Fab Installation & Startup

Siemens now Infineon Technologies is a semiconductor manufacturing company where I was a process yield improvement engineer. Global yield improvements throughout semiconductor manufacturing processes from crystal growth through final device packaging in the US, Europe, and Penang.