1． 负责确保3D NAND集成电路从产品可行性阶段到量产阶段的可测性与可生产性
2． 开发，评估，解决与实施复杂的程序测试
3． 最新技术节点的新产品开发导入到量产开发，测试与评估新测试硬件解决方案
4． 组建与发展晶元可靠性(WLR)与晶元级高温工作寿命(WLH)测试组
5． 领导及与全球多个分部多个部门共同开发实施晶圆级可靠性与晶圆级高温工作寿命测试程序
6． 领导全球工作组协调工作流程，测试方案与测试方法
7． 领导及与全球利益相关者共同执行重要战略测试相关项目
8． 美光半导体(西安)有限责任公司
Responsible for ensuring the testability and manufacturability of integrated circuits from the component
feasibility stage through production ramp.
Build and develop the Wafer Level Reliability and Wafer Level HTOL probe team.
Development, evaluation, debug, and implementation of complex test programs.
Follow up latest technology node from NPI to HVM.
Design, development, testing, and qualification of new test hardware solutions.
Tester platform conversion, test infrastructure coding, pattern conversion and correlation
Leading and collaborating with cross-site and cross-functional teams to develop and implement complex
test solutions.
Leading and collaborating world-wide working groups to align business processes, test
programs, and methodologies.

职位：Test Process Central Engineering, Product Lead
所在部门：TPCE
工作地点：西安
1． 产品主管， 全球测试工艺核心工程团队：
2． 开发，解决，维护 DDR4 DRAM 测设程序，与产品工程师一同设计分析测试硬件
3． 理解失效机理，与全球测试部门共同提高产品质量，可靠性和良率
4． 与生产一起实现产量与质量目标
5． 分析解决设备良率和测试问题
6． 开发软件监控产线良率及生产时间
7． 随机过程控制警报审查及处理，实现自动化处理
8． ATE测试硬件质量把关
9． 开发提供测试时间缩减方案以及测试步骤消除
Product Lead at Micron, Test Process Central Engineering (TPCE) Nov. 2014 – Oct. 2018
Develop, debug, and maintain code that enables massive parallel testing of DDR/GDDR
DRAM.
Interacting closely with Product Engineering, taking part in the designing and debug of test
hardware.
Understand failure mechanisms, develop models and work with worldwide test organization to
improve product quality, reliability and yields
Work closely with manufacturing staff and customers to realize output and quality goals
Analyzing device yield and testing issues;
Develop software to monitor the test production floor yield, as well as test times
SPC alarm review and disposition, enabling auto-disposition
Mongoose ATE Hardware qualification (tester/CSB)
Developing and proving methods to reduce test time while maintaining test completeness
(TTR), Test step elimination.

Responsible for account manager management:
Account manager KPI management
Plan and conduct training and evaluation for account managers
Account manager piecework payment management
Accounts receivable management

职位一：IC验证工程师 2008.12 - 2011.09
工作地点：西安
职责业绩：
Design Verification Engineer(DFV) at Infineon Technologies Xi'an Apr. 2009 – Sep. 2011
(Infineon Technologies Xi’an was acquired by Intel Mobile Communication in May 2011)
IP core verification with Specman random based verification. Responsible for the reference
model development and functional coverage improvement.
Microcontroller Soc verification:
Responsible for the RTL/Gate level verification and flash memory second level verification
and Baseband processor SoC top level verification

职位经历：

1、市场营销工程师（德国英飞凌科技慕尼黑总部） 2007.8 至 2008.2

市场营销工程师：在英飞凌科技汽车电子市场部门实习工作，职责为用VBA开发一款基于Microsoft Excel的产品报价数据分析工具，并进行报价数据的导入和发布工作。

2、2008.3 至 2008.10
验证工程师：在英飞凌科技汽车电子开发部门工作进行微型控制芯片的故障仿真，职责为故障仿真流程自动化，测试向量的产生以及故障覆盖率的提高。

3、验证工程师（英飞凌科技西安有限公司 ）2008.12 至 2009.5

针对SSCG IP核进行基于随机的验证。职责为SSCG参考模型的开发以及功能性覆盖率的提升。

4、验证工程师（英飞凌科技西安有限公司 ）2009.6 至 2010.7
针对英飞凌汽车电子控制器的顶层验证。职责为RTL，Gate级仿
真和芯片上闪存的验证。

5、验证工程师（英飞凌科技西安有限公司 ）2010.8 至 2011.9
汽车总线Flexray IP核的验证、手机基带处理器芯片系统的验证。

SoC verification Engineer at Infineon Technologies Munich Mar. 2008 – Oct. 2008
Work as work-student in the Automotive Department conducting microcontroller gate level
fault simulation:
Responsible for the flow automation, functional test pattern generation, and fault coverage
improvement
Marketing Engineer at Infineon Technologies Munich Aug.2007 - Feb.2008
Work as work-student in Marketing Office in the automotive department. Developed an
internal data sheet analyzer in order to analyze the product price based on Microsoft Excel
VBA and publish data to the stake holders.