工作描述: 负责西南地区(重庆广达、英业达、仁宝、纬创及成都仁宝、纬创)客户端LCM产品上线异常品真因解析,整理报告回馈厂内改善及客户端说明。

工作描述: 1.iPad LCM LQ data collection(machine Q data &H/W CTQ)整理审核供客户认证;

2.iPad LCM 新产品整合导入(P1~MP)

a.Beol~Test 各站Sop&checklist文件汇整及发行;

b.与NPI、MFG、PM整合,mini build & main buid行前会议检讨及daily检讨生产状态;

c.Beol~Test ME data collection汇整;

d.生产良率&异常检讨,各build结束后生产总结;

e.SPC管控项目定义;

f.FMEA &control plan 制定更新;

3.iPad LCM MO段制程当责

a.2nd source 耗材验证导入,降低公司成本;

b.C2B设备Blu放片位置DOE及放片精度稳定性优化,改善客户端flatness&light leakage;

工作描述: 2015.8~至今 捷普科技(成都)有限公司FATP任职制造工程师

主要工作执掌:Mac Book TP 模组新产品导入

1. 负责Trackpad 线体设备架设(电源、气管、网络、ESD、抽风、MES)

2. 负责设备调试接收

3. 负责设备日常点检保养,维护产线正常运行

4. 负责产线SOP、VA、WI制作发行,并培训技术员及产线操作员

5. 负责生产治具、耗材评估及导入

6. 负责生产线downtime分析及不良品解析改善

7. 生产备品评估购买

8. 负责设备供应商调度管理

工作描述: 负责产品类型:Touch Panel

1.LAM、TP、Test各段良率维护、异常处理对策拟定与实施

2.生产耗材评估及导入(无尘布、缓冲材等)

3.各站SOP制作发行

4.助理工程培训及工作指导分配

5.客诉报告撰写

工作描述: 负责产品类型:LCD 模组

1.各站SOP、WI文件制作

2.生产耗材评估及导入(Tuffy胶/Silicon/Teflon等)

3.JI段Bonding 良率维护、监控及异常处理

4.进行DOE确定生产参数及进行良率提升

5.助理工程师培训及日常工作安排

工作描述: 负责产品类型:电视机主板及电源板

1.PCBA每日异常处理对策拟定与实施

2.新F/W评估及验证及FAI Report填写

3.PCBA产品报废判定

4.产线ESD防护与改善

2015/8-Present Jabil (5 years and 7 months )

Electronics/Semiconductor/IC|Foreign Comp.(Eur./N.Amer.)

ME Manufacture Engineer

Description: 2015.8~present Jabil Technology (Chengdu) Company Manufacturing Engineer

Major work: Responsible for new product Mac Book TP module

1. Trackpad line set up (including power/compress air/network/ESD wire/exhaust pipe/MES)

2. Responsible for equipment and fixture accept /fine tune and buy off

3. Responsible for equipment daily check /PM, keep the production line running

4. Write and release SOP/VA/WI, train ME technician and operator

5. Evaluate and import fixture and material

6. Analyze and improve machine downtime and failure unit

7. Spare part evaluate and purchase

8. Arrange and adjust suppliers

2012/10-2015/8 Foxconn GIS (Chengdu) (2 years and 10 months )

Electronics/Semiconductor/IC|>10000 people|Foreign Comp.(Others)

Process Engineering Department Process Engineer

Description: Responsible for touch panel process including LAM/TP/Test

1.Set up process flow and write SOP

2. Evaluate and import material

3.Monitor and keep improving the yield

4.Cooperate with the QC team to deal with the aftersale problem.

5.Training assistant engineering

6.Responsiblity for new project development

7.Do DOE to determine the parameter

2011/4-2012/10 Foxconn XinCheng (Chengdu) (1 year and 6 months )

Electronics/Semiconductor/IC|>10000 people|Foreign Comp.(Others)

Process Engineering Department Process Engineer

Description: Responsible for LCD module JI Bonding section

1.Set up process flow and write SOP/WI

2.Evaluate and import material (such as Tuffy glue/Silicon/Teflon)

3.Monitor JI Bonding section yeild and analyze the failure units.

4.Do DOE to determine the parameter and improve the product quantity

5.Train technician and assign them daily work

2010/7-2011/4 Foxconn Chimei(Shenzhen) PCBA manufacture (9 months )

Electronics/Semiconductor/IC|>10000 people|Foreign Comp.(Others)

FA Department Field Application Engineer (FAE)

Description: 1.Deal with daily PCBA issue and make corrective action

2.Verify new F/W and do FAI report

3.Scrap PCBA verification

4.Production line ESD monitor and improvement