Provide pixel architectures and performances in line with product division roadmap.
Imagine, design and validate pixels, SPADs and their related testchips.
Responsibilities: Manage Innovation & People, roadmap definition and execution, PDK Teams
coordination, customers support.
Highlights:
Innovative pixel architectures, SPAD and associated quench circuits.
New test circuits development.

develop state of the art modeling solutions to support Process and Design Platform milestones.
Responsibilities: people management, planning execution, MHC database, customer interface.
Highlights:
28FD: Technical referent and coordinator for the SPICE, DRM and DK teams (OBEYA).
IMAGING: coordination of the SPICE offer updates and improvements for process maturities.
SPICE Leader of the 28FD technology transfer to SAMSUNG, with a joint SEC-ST models’
extraction.
Third Parties CAD integration: 40nm TSMC, 32-28nm ISDA.

Crolles2 Alliance
: Characterization and modeling of MOS components for the 90, 65 and 45nm technologies.
Responsibilities: Interaction with the design’s teams of the Alliance’s companies for new model
functionalities integration (matching, corner, WPE, STI stress).
Highlights: Technical Leader of the PSP 45nm project (2006): new PSP compact model validation,
development of the extraction & toolkit strategy, training of new engineers, measurements
planning, management of the different model extractions and deliveries among a 5 people team.

Post PhD at LETI (SOI Team), LEG (Power Electronics Team)
: study of interactions between dielectric insulated cells". Realization of
power electronic components characterization benches, modeling and simulation of electronic devices.

Power Electronics Laboratory, Lasers Development
, 20kA), realization of a high voltage probe calibrator and an
electrolytic capacitor ageing bench.
COMPETENCIES
Drive innovation, teamwork, pugnacity, adaptation to changes, autonomy.
General
Coordination, communication, reporting, motivation, coaching.
Management
Technical
Pixel & SPAD, image sensors, technology benchmarking, IP derisking, impact analysis,
electrical characterization, customer interface.