1、Developing CMOS image sensors (CISs) and sensing systems for next generation smartphone
cameras by leading camera-sensor optimization with China HQ camera experts: examples - high dynamic range imaging, event-based vision sensing system.
2、Developing features to drastically enhance the performance and or functionality of sensors, and collaborating with the IS tier sensor vendors to incornorate them in new sensor products for Xiaomi. Part of them has already been added to mass production sensors.
3、Image sensor technology roadmap owner responsible for tuture technology selection.
4、Established image quality simulation worklows for sensor-optics co-design. as well as sensor-ISF co-desien

1、Established sensorA & characterization to be utilized for test chip design & char of ISMC
BSI CIS/SPAD test vehicle & lead the team of ~5 engineers to drive CISSPA technology development with process integration teams: CIS pixel pitch ranging from 1.1um to 0.5um, SPAD pixel pitch ranging from 20um to 6um.
2、Established the 1 gen. TSMC SPAD process general offer platform by leading a cross-team of design, process, sim, char, qual., ESD, business/marketing.
3、Promoted TSMC 3D-stack CIS process to the world by utilizing collaborations with university professors and top technical conferences.
4、Accomplished sensor chip prototyping for various image sensor & dlor start-up companies by managing the risk factors effectively utilizing vast technical knowledge and a skill on cross-team project handling.

1、Accomplished the design of CMOS image sensors, such as Canon EOS-ID X and Canon EOS 6D.
2、Lead the R&D for 2PD PDAF image sensor, high-speed 14bit column parallel ADC with digital
linearity correcton. and charge domain global shutter pixel for CIS.