(Product: AR Display Engine)
-Working as technical lead on process and equipment development starting prototype
1. Take the lead in driving technical, operational and quality issues related to products and engineering teams from the earliest stages of NPI, engineering builds and ramp up.
2. Lead scalable and high throughput manufacturing process/equipment on new product and meet functional requirements.
3. Yield improvements, lead failure analysis and corrective actions.
4. Collaborate with vendor for scalability: equipment design, process readiness, labor planning/training, CT/UPH improvement to meet MP target.
5. Lead NPI build readiness activities, SOP/PFMEA/mSOP.
6. Develop, review fixture/automation bring up/ line qualification requirements with internal team and customers.
7. Proactively identify risks associated with design, manufacturing, and mass production scalability and create plans with team to mitigate the risks.
8. Cross-functional teams communications with Eng/RD/Ops/PM.

-Work as key DRI for EQ development requirements of new automation equipment for Apple projects, from RFP, quotation, DFM discussion, project launch, production assembly, and equipment shipment
1. In RFP early stage, cooperate with account manager in identifying 3D lens lamination for XR lens module/AOI picker for microdisplay technical requirements and create DFM solutions with RD before the project launch which including DFM discussions/communications/demonstrations, and BOM selection.
2. Responsible for project cost quotations, budgetary cost estimations, to ensure project award, win the contract, sales price negotiations, and BOM cost/profit control.
3. Focus on the rationality of project resources allocations, implement and follow up on project priorities and issues.
4. Proactively estimate customer needs and provide corresponding solutions to increase market share.

(Product: TWS)
-Work as key DRI from new touch module development to mass production successfully with high yield (>98% in NPI) and PPOM recognition.
1. Take the lead in driving technical, operational and quality issues related to products and engineering teams from the earliest stages of NPI, engineering builds and ramp up.
2. Develop scalable and high throughput manufacturing process/equipment.
3. Yield improvements, drive failure analysis and corrective actions.
4. Develop vendor for scalability: equipment design, process readiness, labor planning/training, prepare factory to achieve target CT/UPH.
5. Lead NPI build readiness activities.
6. Develop, review fixture/automation bring up/line qualification CTQ requirements with internal team and customer.
7. Work with product design, process, test and automation teams to quickly resolve technical and operational issues and interface between internal team and Clients.
8. Proactively identify risks associated with design, manufacturing, and mass production scalability and develops plan with team to mitigate the risks.
9. Track master issues list, report and close out issues in a timely manner.

(Product: XR Lens Module)
-Work as key DRI to bring-up equipment with Apple AME DRI on XR lens AOI cosmetic inspection.
1. Utilize 5M1E (Man/Machine/Material/Method/Measurement/Environment) to execute all requirements in new product introduction phase.
2. Lead manufacturing control, resolve the abnormal issue, yield/issue tracking/IPQC/DOE improvement, and equipment OEE improvement/bring-up.
3. Host regular meetings and data output discussion with Apple TPM and manufacturing meetings with cross-functional teams.

(Product: Camera Module)
-Work as key DRI on developing advanced folded zoom camera module technology.
Program Management
1. Lead new technology product development and managing product failure issues and quality anomaly with suppliers.
2. Own product development tasks, issue, process setup, validations, the deliverable and the deliveries from NPI to MP.
3. Lead engineering team to solve product issues, DOE, failure analysis, quality issues and yield improvement.
4. Host cross-functional activities for overall project/product issues at RD phase.
5. Drive vendors on material delivery, quality and issues improving.
Design Review
6. Participate in product design review with RD team to innovate a solution that meet customer expectations.
7. Cover key components: sensor, lens, IR filter, actuator/driver IC/gyro.
8. Material BOM cost assessment and review.
Process Setup
9. COB: Lens-actuator mount, prism mount, active alignment.
10. Optical testing: Focusing, image resolution, image cosmetics, actuator/prism characteristic, hall calibration and OIS test.

(Product: Camera Module)
-Work as key DRI on new product development from NPI to mass production.
Design Review
1. Assess camera module product risk, assembly/test process, materials used and BOM cost before project kick-off.
2. Participate in product design review with the Mechanical/Electrical/Optical engineering team to facilitate a solution that meet customer expectations. Program Management
3. Schedule project development milestones, issue tracking/control and deliverable documents.
4. Leading the engineering team in the development phase to solve product issues, improve assembly/testing process capability, jig/fixture design and failure analysis.
5. Drive materials design, specification setup, sample delivery, quality and issues with vendors.
7. Collaborate with the engineering team and operational team to achieve good product quality.
8. Manages cross-functional activities for overall project/product issues from NPI to MP and post-MP Process Control
9. Failure analysis on camera sensor/lens and functional fails
10. Quality control plan, PFMEA, DFMEA
11. SMT: Component mount, laser marking
12. COB: Die attach, wire-bonding, lens-actuator mount, active alignment (holder mount).
13. Optical testing: Focusing, actuator/electrical characteristic, image resolution and blemish cosmetics.

(Product: Wafer-level Chip Scale Package)
1. Responsible for WLCSP backend process, ball mount, 2OI, pick & place.
2. Maintain and improve production yield and product quality.
3. Defined product process flow and propose improvement solution.
4. Managed yield loss solutions and control immediate corrective action.

1. Optimize and tune ASML & Nikon scanner parameter for manufacturing and NPI.
2. Control and maintain process yield and process capability.
3. Monitor process yield and excursions using SPC.
4. Act on process excursions and provide immediate corrective actions to guarantee product quality
5. Perform process experiments for parameter tuning, testing to maintain process
stability and product yield..