• Leading Advanced Process Development team in CTC(Central Technical Center) group.
• Developing brand new process and alternative materials.
• Research and development automation machines for manual process.
• Trouble shooting for chronic and serious problem regarding Camera module process problem.
• Activity for yield improvement for Apple camera module

• Leading an Engineering team with 200ppl, including Process, EPM, FACA, Mechanical, Test
• Leading Project as project leader : Apple’s Dual Camera Module from C5 to C2 before mass production
• Considering schedule, FACA status, Quality control, follow up optical/electrical properties and vendor control
• Start-up/Set-up New factory and NPI line for Camera Module Assy. Equipment
• Involved in setting and start-up of flip chip process/equipment in FOL/AA/EOL assembly
• Coordinate work from different departments, EPM / Process engineer / Equipment engineer / Test engineer
• Final approval for provided engineering builds report before sharing to customer
• Final approval for provided monthly quality production yield report and yield improvement plan at Customer
side.
• Reviewing and approval for Daily/Weekly process/material documentation.
• Final approval for PFMEA & Process Control Plan.
• Final review and approval for engineering report in preparation for customer product qualification/audit.
• Review Module structure/Assembly process/Tooling & Jig.
• Review report and attend on projects kickoff and Apple weekly process and operation meeting.

• Start-up/Set-up Front of line (FOL) production Camera Module Assy. Equipment.
• Involved in setting and start-up of flip chip process/equipment in FOL assembly.
• Flip Chip, Stud bump, Wafer cleaning, Plasma cleaning and other pick and place equipment and process.
• Prepare Standard operation procedure (SOP) and trained local engineers and operators.
• Support/trained engineer on equipment set-up/conversion and troubleshooting.
• Provide assistance for the qualification of new products.
• Front of line (FOL) focal person in Apple customer in terms of Electrical failure and other process
improvements including Yield & FA/CA during weekly/monthly review.
• Review and generates specification based on internal and external requirements.
• Provide assistance and support for product and site customer qualification.
• Provide engineering builds report for new product evaluation and development.
• Provide monthly quality production yield report and yield improvement plan at Customer side.
• Daily/Weekly process/material documentation review.
• PFMEA & Control Plan review.

• Research OLED out-coupling efficiency with Nano imprint lithography process.
• Set-up and operating thermal evaporator machine & Thin Film Process.
• Measure and Analysis optical properties, such as efficiency, luminance and light angle.
• Submitted 2 papers to SCI/SCIE and published

• Design a LED Module and Package to improve light efficiency and reliability performance.
• Generate project at Wire bonding & Die attach process to minimize electrical failure issues.
• Initiate study and generates report for process and material evaluation.
• Initiate engineering reports regarding activities and new Ideas that would lead to product improvements.
• Provide FACA report for all failure issues to customer.

For FOL Process (Wire bonding, Die attach, Molding process)
• Quality control in Wire bonding, Die attach and Flip Chip process.
• Optimization parameter in FOL & Transfer molding process.
• Prepare SOP and train operator.
• Line audit to find abnormal process condition.