• Managed to improve NPI process yields successfully by conducting multiple DOEs and ensured product quality to meet client’s standard from C6.0 to C2.0 (P1 build, EVT, DVT, PVT) and MP
• Familiar with camera module assembly process (COB, flip chip, AA), and reviewed MBO in each build configuration with awareness of data deviation, parameter settings, measurement SOPs, cosmetic defects or any changes made
• Collaborated with cross functional teams in module assembly process development, including process flow, equipment qualifications, validation plans, design reviews (DFM), and testing issues
• Facilitated communications regarding technical problems between machine vendors (dispensingmachine, AA machine) material vendors (FPC, IRCF, epoxy), MI engineers, and clients for module design/process improvements
• Provided technical directions to team members when in problematic scenarios
• Drove open issues to closure by unremittingly monitoring projects and manufacturing status
• Utilizing DOE, pFMEA, 8D report for risk assessment and failure analysis