· Managing TPM, EPM, NPI teams, 15 ppl.
· Lead cross-functional teams to develop and deliver BMU packages, ensuring alignment with Apple's quality and performance standards.
· Oversee failure analysis and root cause analysis processes to identify and resolve issues efficiently.
· Collaborate with engineering, design, and manufacturing teams to optimize processes and enhance product reliability.
· Manage project timelines, resource allocation, and risk assessments to ensure successful project completion.
· Foster a culture of continuous improvement and innovation within the team.

ENG. PROJECT MANAGER->SENIOR MANAGER Nov 2018 – Sep 2021-Now
• Successfully completed 6 camera module package qualification for Apple with high volume production.
• Managing a PM team of 8 for camera module package development and qualification.
• Developed high quality build planning for multiple builds that meeting project schedule and shipment with well-prepared materials and equipment.
• Managed various functional teams; Engineering team, QA team, Test team and Procurement team for the smooth progress of each build from initial prototype through mass production.
• Qualified 4 new Lines to meet ramp demand and NPI requirements, including new SMT, Underfill and Singulation equipment, and tooling/fixtures.
• Reviewed project performance at each build stage to make sure meeting design, quality and reliability requirement.

R&D MANAGER Mar 2015 - Nov 2018
• Responsible for all UTAC Dongguan advance materials and direct materials introduction and qualifications focusing on QFN, BGA and SIP packages.
• EMI shielding materials, Sintering epoxy and Embedded substrate
• Substrate (2L, 4L & 6L), Leadframe (different surface roughness), epoxy, wire (Au, PdCu & AuPdCu), mold compound, solder paste and others.
• Leading a build sheet team for creating build sheet for all devices running in assembly line, which including material usage and process flows definition.
• Responsible for all customer complaints, which related to materials quality issues.
• Created and revised all direct material qualification procedure to enhance the qualification procedure and quality of qualified material. Created wider scope of material qualification procedure.
• Successfully qualified new low cost material set with 20% COGS reduction, which received UTAC CEO Award as company highest recognition.

Responsible as KCC's main contact window for technical & Quality support and technical marketing for KCC's customers in China and South East Asia, which are including ST Micro, Fairchild, Infineon, ASE and others with total sales up to USD 30 millions.
· Responsible in defining new or improve manufacturing process to solve technical issues and qualification of all KCC molding compound and die attach.
· Directed all technical marketing for all KCC molding compound, die attach, DAF, ceramic and others materials.
· Communicating customer needs and wishes to development team in Korea.
· Developing and maintaining good relationship with all customers.

Responsible for recommendation, technical support and qualification of all molding compound for new DSO (Dual Side Outline) packages development or current Production packages.
· Reviewed and revised specifications including Purchase Specification, Process Specification, Work Instruction, and Control Plan for the continual improvement of production and operational procedures.
· Leaded a task force team to resolve mold void issue by optimizing the process parameter and mold compound formulation for DSO-52 packages.
· Performed as a team player with other colleagues includes German, Indonesian and Philippines to complete tasks in time or solving technical issues.

Performed daily monitoring on Production line issue to fully understand Molding and Heat Sink Attach line issue and maintain Mold Yield at 99.995%.
· Conducted major evaluation/experiments (DOE) to characterize failures and provided dispositions on implications attributed to process, material defects and/or machine related problems.
· Reviewed and revised process line specifications including Process Specification, Work Instruction, FMEA, and Control Plan for the continual improvement of production and operational procedures.
· Implemented company first bar-coding system in Production Line better line control.

Responsible for new Molding Compound Products development, testing and prototype production. Conducted experimental research on various properties of the molding compound (physical, chemical and electrical properties)
· Developed company first Green High Thermal Conductivity Molding Compound. The molding compound was sent to Infineon for qualification.
· Provided Molding Compound knowledge training to various customers.
· Performed full monitoring on new or improved product from pilot plant to mass production to achieve customer’s specification and requirement.