● Responsible for the planning and implementation of the R&D line
upgrade to pilot-run line.
● Responsible for establishing product cost estimation models,
optimizing personnel organizational structure, and introducing
necessary processes and management systems for MP line (such as
ERP, MES)．
● Lead the team to complete the development of key materials and
reduce mass production costs.

Developed of Tianma's first self-made Micro-LED sample.
Lead the team to go through all CELL & Module processes in
MicroLED field.
Cooperate with the marketing department and strategic planning
department to complete Tianma's three-year MicroLED technology
development strategy.
By enhance employees a sense of achievement in their work,
optimizing training and coaching mechanisms, and reducing
employees’ distrust of the system, the team’s turnover rate was
reduced from 60% to 15%.
By controlling the number of meeting participants, controlling the
frequency of meetings, and clarifying the purpose of meetings and
decision-making matters, we can improve management's office
efficiency and reduce the average monthly meeting hours within the
team by 8 hours.

Assisted in the construction of a MiniLED experimental line with a
monthly production capacity of 100 square meters.
Lead the team to go through all CELL & Module processes in MiniLED
field.
Developed of thick Cu electroplating process for TFT panel of miniled.
Co-work with the patent team and standard setting team to complete
BOE's miniled & microled patent layout and standard setting direction
planning.

Developed of thin-film flip chip pachaging process.
Developed of ultra-high power UVC LED packaging process.
Developed of laser diode packaging process.
Developed of miniled packaging process
Developed of microLED packaging process
Built up the first optical and RA lab.
Built up the first miniled packaging experimental line.

Developed of flip chip die-bond process for high power LED lighting
product.
Developed of molding process for secondary optical structure.
Developed of high heat dissipation substrate for high power LED
package product.

New Materials evaluation.
New Process of Touch Panel Development.

IMR Process Development.
New Product Development.
Gravure Printing Process Handling.
Screen Printing Process Handling